Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the principles involved translate well to other categories of...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Monthei, Dean L. (VerfasserIn)
Format:	Elektronisch E-Book
Sprache:	English
Veröffentlicht:	Boston, MA Springer US 1999
Schriftenreihe:	Electronic Packaging and Interconnects Series 2
Schlagworte:	Engineering Microwaves, RF and Optical Engineering Control, Robotics, Mechatronics Electrical Engineering Control engineering Robotics Mechatronics Electrical engineering Microwaves Optical engineering
Online-Zugang:	DE-634 URL des Erstveröffentlichers
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