Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss pr...
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| Sprache: | English |
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| LEADER | 00000nam a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV045148996 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 180827s2000 xx o|||| 00||| eng d | ||
| 020 | |a 9781475731590 |9 978-1-4757-3159-0 | ||
| 024 | 7 | |a 10.1007/978-1-4757-3159-0 |2 doi | |
| 035 | |a (ZDB-2-ENG)978-1-4757-3159-0 | ||
| 035 | |a (OCoLC)1050944354 | ||
| 035 | |a (DE-599)BVBBV045148996 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-573 |a DE-634 | ||
| 082 | 0 | |a 670 |2 23 | |
| 245 | 1 | 0 | |a Benefiting from Thermal and Mechanical Simulation in Micro-Electronics |c edited by G. Q. Zhang, L. J. Ernst, O. de Saint Leger |
| 264 | 1 | |a Boston, MA |b Springer US |c 2000 | |
| 300 | |a 1 Online-Ressource (X, 192 p) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 520 | |a Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- <LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics | ||
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Manufacturing, Machines, Tools | |
| 650 | 4 | |a Mechanics | |
| 650 | 4 | |a Optical and Electronic Materials | |
| 650 | 4 | |a Electrical Engineering | |
| 650 | 4 | |a Systems Theory, Control | |
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a System theory | |
| 650 | 4 | |a Mechanics | |
| 650 | 4 | |a Manufacturing industries | |
| 650 | 4 | |a Machines | |
| 650 | 4 | |a Tools | |
| 650 | 4 | |a Electrical engineering | |
| 650 | 4 | |a Optical materials | |
| 650 | 4 | |a Electronic materials | |
| 650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Simulation |0 (DE-588)4055072-2 |2 gnd |9 rswk-swf |
| 655 | 7 | |8 1\p |0 (DE-588)1071861417 |a Konferenzschrift |y 2000 |z Eindhoven |2 gnd-content | |
| 655 | 7 | |8 2\p |0 (DE-588)1071861417 |a Konferenzschrift |y 2002 |z Paris |2 gnd-content | |
| 689 | 0 | 0 | |a Mikroelektronik |0 (DE-588)4039207-7 |D s |
| 689 | 0 | 1 | |a Simulation |0 (DE-588)4055072-2 |D s |
| 689 | 0 | |8 3\p |5 DE-604 | |
| 700 | 1 | |a Zhang, G. Q. |4 edt | |
| 700 | 1 | |a Ernst, L. J. |4 edt | |
| 700 | 1 | |a Saint Leger, O. de |4 edt | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9781441948731 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-1-4757-3159-0 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-2-ENG | ||
| 940 | 1 | |q ZDB-2-ENG_2000/2004 | |
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 883 | 1 | |8 2\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 883 | 1 | |8 3\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-030538695 | |
| 966 | e | |u https://doi.org/10.1007/978-1-4757-3159-0 |l DE-573 |p ZDB-2-ENG |q ZDB-2-ENG_2000/2004 |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4757-3159-0 |l DE-634 |p ZDB-2-ENG |q ZDB-2-ENG_Archiv |x Verlag |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1819303525278023680 |
|---|---|
| any_adam_object | |
| author2 | Zhang, G. Q. Ernst, L. J. Saint Leger, O. de |
| author2_role | edt edt edt |
| author2_variant | g q z gq gqz l j e lj lje l o d s lod lods |
| author_facet | Zhang, G. Q. Ernst, L. J. Saint Leger, O. de |
| building | Verbundindex |
| bvnumber | BV045148996 |
| collection | ZDB-2-ENG |
| ctrlnum | (ZDB-2-ENG)978-1-4757-3159-0 (OCoLC)1050944354 (DE-599)BVBBV045148996 |
| dewey-full | 670 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 670 - Manufacturing |
| dewey-raw | 670 |
| dewey-search | 670 |
| dewey-sort | 3670 |
| dewey-tens | 670 - Manufacturing |
| discipline | Werkstoffwissenschaften / Fertigungstechnik |
| doi_str_mv | 10.1007/978-1-4757-3159-0 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03692nam a2200697zc 4500</leader><controlfield tag="001">BV045148996</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">180827s2000 xx o|||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781475731590</subfield><subfield code="9">978-1-4757-3159-0</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-1-4757-3159-0</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)978-1-4757-3159-0</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1050944354</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045148996</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-573</subfield><subfield code="a">DE-634</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">670</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Benefiting from Thermal and Mechanical Simulation in Micro-Electronics</subfield><subfield code="c">edited by G. Q. Zhang, L. J. Ernst, O. de Saint Leger</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Boston, MA</subfield><subfield code="b">Springer US</subfield><subfield code="c">2000</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (X, 192 p)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- <LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Manufacturing, Machines, Tools</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Mechanics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrical Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Systems Theory, Control</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">System theory</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Mechanics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Manufacturing industries</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Machines</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Tools</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrical engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic materials</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Simulation</subfield><subfield code="0">(DE-588)4055072-2</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="8">1\p</subfield><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="y">2000</subfield><subfield code="z">Eindhoven</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="8">2\p</subfield><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="y">2002</subfield><subfield code="z">Paris</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Simulation</subfield><subfield code="0">(DE-588)4055072-2</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">3\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Zhang, G. Q.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ernst, L. J.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Saint Leger, O. de</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9781441948731</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-1-4757-3159-0</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_2000/2004</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">2\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">3\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030538695</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4757-3159-0</subfield><subfield code="l">DE-573</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="q">ZDB-2-ENG_2000/2004</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4757-3159-0</subfield><subfield code="l">DE-634</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="q">ZDB-2-ENG_Archiv</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| genre | 1\p (DE-588)1071861417 Konferenzschrift 2000 Eindhoven gnd-content 2\p (DE-588)1071861417 Konferenzschrift 2002 Paris gnd-content |
| genre_facet | Konferenzschrift 2000 Eindhoven Konferenzschrift 2002 Paris |
| id | DE-604.BV045148996 |
| illustrated | Not Illustrated |
| indexdate | 2024-12-24T06:50:45Z |
| institution | BVB |
| isbn | 9781475731590 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030538695 |
| oclc_num | 1050944354 |
| open_access_boolean | |
| owner | DE-573 DE-634 |
| owner_facet | DE-573 DE-634 |
| physical | 1 Online-Ressource (X, 192 p) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_Archiv |
| publishDate | 2000 |
| publishDateSearch | 2000 |
| publishDateSort | 2000 |
| publisher | Springer US |
| record_format | marc |
| spelling | Benefiting from Thermal and Mechanical Simulation in Micro-Electronics edited by G. Q. Zhang, L. J. Ernst, O. de Saint Leger Boston, MA Springer US 2000 1 Online-Ressource (X, 192 p) txt rdacontent c rdamedia cr rdacarrier Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- <LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics Engineering Manufacturing, Machines, Tools Mechanics Optical and Electronic Materials Electrical Engineering Systems Theory, Control System theory Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Simulation (DE-588)4055072-2 gnd rswk-swf 1\p (DE-588)1071861417 Konferenzschrift 2000 Eindhoven gnd-content 2\p (DE-588)1071861417 Konferenzschrift 2002 Paris gnd-content Mikroelektronik (DE-588)4039207-7 s Simulation (DE-588)4055072-2 s 3\p DE-604 Zhang, G. Q. edt Ernst, L. J. edt Saint Leger, O. de edt Erscheint auch als Druck-Ausgabe 9781441948731 https://doi.org/10.1007/978-1-4757-3159-0 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 3\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Benefiting from Thermal and Mechanical Simulation in Micro-Electronics Engineering Manufacturing, Machines, Tools Mechanics Optical and Electronic Materials Electrical Engineering Systems Theory, Control System theory Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Mikroelektronik (DE-588)4039207-7 gnd Simulation (DE-588)4055072-2 gnd |
| subject_GND | (DE-588)4039207-7 (DE-588)4055072-2 (DE-588)1071861417 |
| title | Benefiting from Thermal and Mechanical Simulation in Micro-Electronics |
| title_auth | Benefiting from Thermal and Mechanical Simulation in Micro-Electronics |
| title_exact_search | Benefiting from Thermal and Mechanical Simulation in Micro-Electronics |
| title_full | Benefiting from Thermal and Mechanical Simulation in Micro-Electronics edited by G. Q. Zhang, L. J. Ernst, O. de Saint Leger |
| title_fullStr | Benefiting from Thermal and Mechanical Simulation in Micro-Electronics edited by G. Q. Zhang, L. J. Ernst, O. de Saint Leger |
| title_full_unstemmed | Benefiting from Thermal and Mechanical Simulation in Micro-Electronics edited by G. Q. Zhang, L. J. Ernst, O. de Saint Leger |
| title_short | Benefiting from Thermal and Mechanical Simulation in Micro-Electronics |
| title_sort | benefiting from thermal and mechanical simulation in micro electronics |
| topic | Engineering Manufacturing, Machines, Tools Mechanics Optical and Electronic Materials Electrical Engineering Systems Theory, Control System theory Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Mikroelektronik (DE-588)4039207-7 gnd Simulation (DE-588)4055072-2 gnd |
| topic_facet | Engineering Manufacturing, Machines, Tools Mechanics Optical and Electronic Materials Electrical Engineering Systems Theory, Control System theory Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Mikroelektronik Simulation Konferenzschrift 2000 Eindhoven Konferenzschrift 2002 Paris |
| url | https://doi.org/10.1007/978-1-4757-3159-0 |
| work_keys_str_mv | AT zhanggq benefitingfromthermalandmechanicalsimulationinmicroelectronics AT ernstlj benefitingfromthermalandmechanicalsimulationinmicroelectronics AT saintlegerode benefitingfromthermalandmechanicalsimulationinmicroelectronics |