Robust design of microelectronics assemblies against mechanical shock, temperature and moisture
This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...
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| Hauptverfasser: | , |
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Cambridge, UK
Woodhead Publishing
[2015]
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| Schriftenreihe: | Woodhead Publishing series in electronic and optical materials
no. 81 |
| Schlagworte: | |
| Online-Zugang: | DE-1046 DE-860 URL des Erstveröffentlichers |
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| Zusammenfassung: | This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. Detailed chapters cover: temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. -- |
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| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 online resource |
| ISBN: | 9780857099112 0857099116 9781845695286 |