Handbook of VLSI microlithography principles, technology, and applications
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Format: | Elektronisch E-Book |
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Sprache: | English |
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Park Ridge, N.J., U.S.A.
Noyes Publications
©1991
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Schriftenreihe: | Materials science and process technology series
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Online-Zugang: | FAW01 Volltext |
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245 | 1 | 0 | |a Handbook of VLSI microlithography |b principles, technology, and applications |c edited by William B. Glendinning, John N. Helbert |
264 | 1 | |a Park Ridge, N.J., U.S.A. |b Noyes Publications |c ©1991 | |
300 | |a 1 Online-Ressource (xxii, 649 pages) | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
490 | 0 | |a Materials science and process technology series | |
500 | |a Includes bibliographical references and index | ||
500 | |a This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook | ||
650 | 7 | |a TECHNOLOGY & ENGINEERING / Mechanical |2 bisacsh | |
650 | 7 | |a Lithographie (Halbleitertechnologie) |2 swd | |
650 | 7 | |a Photolithographie (Halbleitertechnologie) |2 swd | |
650 | 7 | |a VLSI. |2 swd | |
650 | 7 | |a Integrated circuits / Very large scale integration |2 fast | |
650 | 7 | |a Microlithography |2 fast | |
650 | 4 | |a Integrated circuits |x Very large scale integration | |
650 | 4 | |a Microlithography | |
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700 | 1 | |a Glendinning, William B. |e Sonstige |4 oth | |
700 | 1 | |a Helbert, John N. |e Sonstige |4 oth | |
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Datensatz im Suchindex
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any_adam_object | |
building | Verbundindex |
bvnumber | BV042308598 |
collection | ZDB-33-ESD |
ctrlnum | (OCoLC)555773428 (DE-599)BVBBV042308598 |
dewey-full | 621.381/531 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381/531 |
dewey-search | 621.381/531 |
dewey-sort | 3621.381 3531 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Electronic eBook |
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id | DE-604.BV042308598 |
illustrated | Not Illustrated |
indexdate | 2024-07-10T01:17:58Z |
institution | BVB |
isbn | 0815512813 1437728227 9780815512813 9781437728224 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027745590 |
oclc_num | 555773428 |
open_access_boolean | |
owner | DE-1046 |
owner_facet | DE-1046 |
physical | 1 Online-Ressource (xxii, 649 pages) |
psigel | ZDB-33-ESD ZDB-33-ESD FAW_PDA_ESD |
publishDate | 1991 |
publishDateSearch | 1991 |
publishDateSort | 1991 |
publisher | Noyes Publications |
record_format | marc |
series2 | Materials science and process technology series |
spelling | Handbook of VLSI microlithography principles, technology, and applications edited by William B. Glendinning, John N. Helbert Park Ridge, N.J., U.S.A. Noyes Publications ©1991 1 Online-Ressource (xxii, 649 pages) txt rdacontent c rdamedia cr rdacarrier Materials science and process technology series Includes bibliographical references and index This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook TECHNOLOGY & ENGINEERING / Mechanical bisacsh Lithographie (Halbleitertechnologie) swd Photolithographie (Halbleitertechnologie) swd VLSI. swd Integrated circuits / Very large scale integration fast Microlithography fast Integrated circuits Very large scale integration Microlithography Fotolithografie Halbleitertechnologie (DE-588)4174516-4 gnd rswk-swf Lithografie Halbleitertechnologie (DE-588)4191584-7 gnd rswk-swf VLSI (DE-588)4117388-0 gnd rswk-swf Elektronenstrahllithografie (DE-588)4151897-4 gnd rswk-swf VLSI (DE-588)4117388-0 s Lithografie Halbleitertechnologie (DE-588)4191584-7 s 1\p DE-604 Fotolithografie Halbleitertechnologie (DE-588)4174516-4 s 2\p DE-604 Elektronenstrahllithografie (DE-588)4151897-4 s 3\p DE-604 Glendinning, William B. Sonstige oth Helbert, John N. Sonstige oth http://www.sciencedirect.com/science/book/9780815512813 Verlag Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 3\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
spellingShingle | Handbook of VLSI microlithography principles, technology, and applications TECHNOLOGY & ENGINEERING / Mechanical bisacsh Lithographie (Halbleitertechnologie) swd Photolithographie (Halbleitertechnologie) swd VLSI. swd Integrated circuits / Very large scale integration fast Microlithography fast Integrated circuits Very large scale integration Microlithography Fotolithografie Halbleitertechnologie (DE-588)4174516-4 gnd Lithografie Halbleitertechnologie (DE-588)4191584-7 gnd VLSI (DE-588)4117388-0 gnd Elektronenstrahllithografie (DE-588)4151897-4 gnd |
subject_GND | (DE-588)4174516-4 (DE-588)4191584-7 (DE-588)4117388-0 (DE-588)4151897-4 |
title | Handbook of VLSI microlithography principles, technology, and applications |
title_auth | Handbook of VLSI microlithography principles, technology, and applications |
title_exact_search | Handbook of VLSI microlithography principles, technology, and applications |
title_full | Handbook of VLSI microlithography principles, technology, and applications edited by William B. Glendinning, John N. Helbert |
title_fullStr | Handbook of VLSI microlithography principles, technology, and applications edited by William B. Glendinning, John N. Helbert |
title_full_unstemmed | Handbook of VLSI microlithography principles, technology, and applications edited by William B. Glendinning, John N. Helbert |
title_short | Handbook of VLSI microlithography |
title_sort | handbook of vlsi microlithography principles technology and applications |
title_sub | principles, technology, and applications |
topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Lithographie (Halbleitertechnologie) swd Photolithographie (Halbleitertechnologie) swd VLSI. swd Integrated circuits / Very large scale integration fast Microlithography fast Integrated circuits Very large scale integration Microlithography Fotolithografie Halbleitertechnologie (DE-588)4174516-4 gnd Lithografie Halbleitertechnologie (DE-588)4191584-7 gnd VLSI (DE-588)4117388-0 gnd Elektronenstrahllithografie (DE-588)4151897-4 gnd |
topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Lithographie (Halbleitertechnologie) Photolithographie (Halbleitertechnologie) VLSI. Integrated circuits / Very large scale integration Microlithography Integrated circuits Very large scale integration Fotolithografie Halbleitertechnologie Lithografie Halbleitertechnologie VLSI Elektronenstrahllithografie |
url | http://www.sciencedirect.com/science/book/9780815512813 |
work_keys_str_mv | AT glendinningwilliamb handbookofvlsimicrolithographyprinciplestechnologyandapplications AT helbertjohnn handbookofvlsimicrolithographyprinciplestechnologyandapplications |