Compact InP spot-size converter with vertically tapered core layer formed by micro-loading effect
A compact (200 μm) spot-size converter (SSC) with a vertically tapered core layer is developed, which is fabricated with a simple wafer process using the micro-loading effect. It is confirmed that the vertical spot size of the SSC exceeded 2 μm, which was double that of the original waveguide. As a...
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Veröffentlicht in: | Electronics letters 2017-06, Vol.53 (12), p.797-799 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | A compact (200 μm) spot-size converter (SSC) with a vertically tapered core layer is developed, which is fabricated with a simple wafer process using the micro-loading effect. It is confirmed that the vertical spot size of the SSC exceeded 2 μm, which was double that of the original waveguide. As a result, an InP waveguide integrated with the SSCs exhibited a coupling loss of |
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ISSN: | 0013-5194 1350-911X 1350-911X |
DOI: | 10.1049/el.2017.0711 |