Compact InP spot-size converter with vertically tapered core layer formed by micro-loading effect

A compact (200 μm) spot-size converter (SSC) with a vertically tapered core layer is developed, which is fabricated with a simple wafer process using the micro-loading effect. It is confirmed that the vertical spot size of the SSC exceeded 2 μm, which was double that of the original waveguide. As a...

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Veröffentlicht in:Electronics letters 2017-06, Vol.53 (12), p.797-799
Hauptverfasser: Ueda, Y, Ogiso, Y, Kashio, N, Hashizume, Y, Kikuchi, N, Ishikawa, M, Kohtoku, M
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Sprache:eng
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Zusammenfassung:A compact (200 μm) spot-size converter (SSC) with a vertically tapered core layer is developed, which is fabricated with a simple wafer process using the micro-loading effect. It is confirmed that the vertical spot size of the SSC exceeded 2 μm, which was double that of the original waveguide. As a result, an InP waveguide integrated with the SSCs exhibited a coupling loss of
ISSN:0013-5194
1350-911X
1350-911X
DOI:10.1049/el.2017.0711