Computer simulation of sputter broadening due to ion bombardment in Au-Ag thin film couple depth profiling

Computer simulation of sputter broadening due to ion bombardment in Au-Ag thin film couple depth profiling

Atomic mixing of gold (5 and 10 monolayers) thin films on silver substratees during sputter depth profiling with l-3keV argon ions at angles of incidence 0", 15°, 30°, 45° has been studied by computer simulation. Binary collision approximations have been applied. The original step-like profile...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:International journal of electronics 1992-11, Vol.73 (5), p.977-979
Hauptverfasser: SCHWARZMANN, I. L., GOLDINER, M. G., PLAKHOTNIKOV, O. I.
Format: Artikel
Sprache:eng
Schlagworte:
Engineering
Engineering, Electrical & Electronic
Science & Technology
Technology
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Atomic mixing of gold (5 and 10 monolayers) thin films on silver substratees during sputter depth profiling with l-3keV argon ions at angles of incidence 0", 15°, 30°, 45° has been studied by computer simulation. Binary collision approximations have been applied. The original step-like profile is broadened asymmetrically by ion bombardment and the 0-5 concentration plane is shifted towards the inside of the sample
ISSN:0020-7217
1362-3060
DOI:10.1080/00207219208925750