Crosstalk Analysis of Triangular CNT Bundle Interconnects

Triangular cross-sectioned carbon nanotube (CNT) bundle interconnects have gained attention recently due to their inherent advantage of least electrostatic coupling and hence reduced crosstalk. Moreover, this technology is in tune with the idea of miniaturization of components in integrated circuits. For the first time, this paper analyses and discusses the crosstalk behaviour of triangular CNT bundle interconnects in two-line and three-line configurations. First, the equivalent circuit model of the triangular CNT bundle is presented. Resistance, capacitance and inductance values are calculated for 20 nm and 14 nm technology nodes. CNTFET-based drivers and loads are connected to the interconnects. Performance analysis of triangular CNT bundles with respect to traditionally proposed square CNT bundles is done. The performance metrics that determine the functionality of the interconnects such as propagation delay, power dissipation, crosstalk-induced delay and dynamic power dissipation, are found by HSPICE simulations. Results show that both square and triangular CNT bundles suffer from crosstalk and of the two, triangular CNT bundles perform better than square CNT bundles.