Preparation of TiO2/Sb–SnO2 composite by a polymer pyrolysis method for conducting fillers

Study and development of multifunctional titanium dioxide (TiO2)-based composite have been focused on by researchers for years. Herein, TiO2-based antimony doped tin oxide (TiO2/Sb–SnO2) conductive composite was facilely prepared by a polymer pyrolysis method. The obtained composite was characterize...

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Veröffentlicht in:Materials science in semiconductor processing 2021-10, Vol.133, p.105922, Article 105922
Hauptverfasser: Wang, Yanan, Qian, Jianhua, Xing, Jinjuan, Xu, Jiasheng, Wang, Xikang, Yu, Xiue, Liu, Lin
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Sprache:eng
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Zusammenfassung:Study and development of multifunctional titanium dioxide (TiO2)-based composite have been focused on by researchers for years. Herein, TiO2-based antimony doped tin oxide (TiO2/Sb–SnO2) conductive composite was facilely prepared by a polymer pyrolysis method. The obtained composite was characterized by thermogravimetry-differential thermal analysis(TG-DTA), Fourier transform infrared spectroscopy (FTIR), scanning electron microscope (SEM), transmission electron microscope (TEM), X-ray fluorescence spectrometer (XRF), powder X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), electron spin resonance (ESR) and UV–Vis diffuse reflectance (DRS). The Ti–Sn–Sb polyacrylate precursor was pyrolyzed to prepare a highly crystalline TiO2/Sb–SnO2 composite, and the pyrolysis reaction mechanism was discussed. The TiO2/Sb–SnO2 composite whose molar ratio of Ti to Sn was 5:1 with 8.3% Sb being doped into SnO2, had the narrowest equivalent energy gap of 2.79 eV and the lowest charge transfer resistance, which led to the cascading charge transfer fast and enhances the conductivity, with a resistivity of 15.42 Ω cm. The solid-solid phase interfacial synergism effect and the “staggered” type double heterojunction structure of TiO2/Sb–SnO2 composite both promoted the electrons migrating from TiO2(A) to TiO2(R) and further to Sb–SnO2 in a cascade way. The results give a novel strategy for industrially manufacturing conductive composite filler.
ISSN:1369-8001
1873-4081
DOI:10.1016/j.mssp.2021.105922