Binderless Bark Particleboard Made from Gelam (Melaleuca viridiflora Sol. ex Gaertn.) Bark Waste: The Effect of the Pressing Temperature on Its Mechanical and Physical Properties

This study investigated the effects of the pressing temperature on the mechanical and physical properties of binderless bark particleboard made from Gelam bark waste and the improvement of those properties. In addition, the thermal insulation properties of the particleboard were determined. Four dif...

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Veröffentlicht in:Bioresources 2021-05, Vol.16 (2), p.4171-4199
Hauptverfasser: Christy, Eva Oktoberyani, Soemarno, Sumarlan, Sumardi Hadi, Soehardjono, Agoes
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Sprache:eng
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Zusammenfassung:This study investigated the effects of the pressing temperature on the mechanical and physical properties of binderless bark particleboard made from Gelam bark waste and the improvement of those properties. In addition, the thermal insulation properties of the particleboard were determined. Four different temperatures (140 degrees C, 160 degrees C, 180 degrees C, and 200 degrees C) were used to make single-layer binderless bark particleboard with a target density of less than or equal to 0.59 g/cm3. Results revealed that the pressing temperature affected the mechanical properties (modulus of rupture, modulus of elasticity, and tensile strength perpendicular to panel surface), which increased as the temperature increased, and the physical properties (thickness swelling and water absorption), which decreased as the temperature increased. Based on the Tukey test, increasing the temperature from 180 to 200 degrees C did not significantly affect the mechanical or physical properties, except for the tensile strength perpendicular to panel surface. None of the mechanical properties met SNI standard 032105-2006 (2006); however, the 12% maximum thickness swelling requirement was met for binderless bark particleboard hot-pressed at 200 degrees C. Binderless bark particleboard hot-pressed at 200 degrees C had high water resistance, regardless of its low strength, and a thermal conductivity value of 0.14 W/m center dot K. Superscript/Subscript Available
ISSN:1930-2126
1930-2126
DOI:10.15376/biores.16.2.4171-4199