Origins of genuine Ohmic van der Waals contact between indium and MoS2
The achievement of ultraclean Ohmic van der Waals (vdW) contacts at metal/transition-metal dichalcogenide (TMDC) interfaces would represent a critical step for the development of high-performance electronic and optoelectronic devices based on two-dimensional (2D) semiconductors. Herein, we report th...
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Veröffentlicht in: | NPJ 2D materials and applications 2021-01, Vol.5 (1), p.1-10, Article 9 |
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Sprache: | eng |
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Zusammenfassung: | The achievement of ultraclean Ohmic van der Waals (vdW) contacts at metal/transition-metal dichalcogenide (TMDC) interfaces would represent a critical step for the development of high-performance electronic and optoelectronic devices based on two-dimensional (2D) semiconductors. Herein, we report the fabrication of ultraclean vdW contacts between indium (In) and molybdenum disulfide (MoS
2
) and the clarification of the atomistic origins of its Ohmic-like transport properties. Atomically clean In/MoS
2
vdW contacts are achieved by evaporating In with a relatively low thermal energy and subsequently cooling the substrate holder down to ~100 K by liquid nitrogen. We reveal that the high-quality In/MoS
2
vdW contacts are characterized by a small interfacial charge transfer and the Ohmic-like transport based on the field-emission mechanism over a wide temperature range from 2.4 to 300 K. Accordingly, the contact resistance reaches ~600 Ω μm and ~1000 Ω μm at cryogenic temperatures for the few-layer and monolayer MoS
2
cases, respectively. Density functional calculations show that the formation of large in-gap states due to the hybridization between In and MoS
2
conduction band edge states is the microscopic origins of the Ohmic charge injection. We suggest that seeking a mechanism to generate strong density of in-gap states while maintaining the pristine contact geometry with marginal interfacial charge transfer could be a general strategy to simultaneously avoid Fermi-level pinning and minimize contact resistance for 2D vdW materials. |
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ISSN: | 2397-7132 2397-7132 |
DOI: | 10.1038/s41699-020-00191-z |