Displacement Damage Effects Mitigation Approach for Heterojunction Bipolar Transistor Frequency Synthesizers

This work focuses on the design issues of radio frequency (RF) bipolar integrated circuits (ICs) as a part of frequency synthesizers for extreme environmental applications. It is shown that silicon-germanium (SiGe) and gallium arsenide (GaAs) heterojunction bipolar transistors (HBTs) as well as bipo...

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Veröffentlicht in:IEEE transactions on nuclear science 2020-11, Vol.67 (11), p.2396-2404
Hauptverfasser: Sotskov, Denis I., Elesin, Vadim V., Kuznetsov, Alexander G., Zhidkov, Nikita M., Metelkin, Igor O., Amburkin, Konstantin M., Amburkin, Dmitry M., Usachev, Nikolay A., Boychenko, Dmitry V., Elesina, Varvara V.
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Sprache:eng
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Zusammenfassung:This work focuses on the design issues of radio frequency (RF) bipolar integrated circuits (ICs) as a part of frequency synthesizers for extreme environmental applications. It is shown that silicon-germanium (SiGe) and gallium arsenide (GaAs) heterojunction bipolar transistors (HBTs) as well as bipolar RF ICs (including frequency dividers, voltage-controlled oscillators, and wide-band amplifiers) are highly sensitive to ambient temperature and radiation-induced displacement damage. This article also presents a design approach based on specialized HBT macromodels and hardening techniques.
ISSN:0018-9499
1558-1578
DOI:10.1109/TNS.2020.3015560