AlN/Cu composite ceramic substrate fabricated using a novel TiN/AgCuTi composite brazing alloy

We developed a newly-designed TiN/AgCuTi composite brazing alloy to significantly improve the bonding strength of AlN/Cu composite ceramics, which can endow high power electronic devices with superior compatibility with large current transport and high voltage resistance. Via the systematic microstr...

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Veröffentlicht in:	Journal of the European Ceramic Society 2020-12, Vol.40 (15), p.5332-5338
Hauptverfasser:	Lv, Jinling, Huang, Yilian, Fu, Renli, Ji, Yanru, Wu, Binyong, Liu, Xuhai
Format:	Artikel
Sprache:	eng
Schlagworte:	AlN ceramic AMB Bonding strength Composite filler Materials Science Materials Science, Ceramics Microstructure Science & Technology Technology
Online-Zugang:	Volltext
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