AlN/Cu composite ceramic substrate fabricated using a novel TiN/AgCuTi composite brazing alloy

We developed a newly-designed TiN/AgCuTi composite brazing alloy to significantly improve the bonding strength of AlN/Cu composite ceramics, which can endow high power electronic devices with superior compatibility with large current transport and high voltage resistance. Via the systematic microstructure investigation of the brazed joint by scanning electron microscopy and X-ray diffractometer, we found that added TiN particles could decrease the thickness of brittle reaction layer and promote the formation of fine TiCu particles in brazed joint, leading to dispersion strengthened and decreased CTE mismatch of the ceramic/metal composite. Importantly, the maximum bonding strength of 131 MPa was obtained for AlN and copper foil brazed joining via composite filler with TiN(4 wt.%)/AgCuTi, which is approximately 150 % higher than the case without TiN addition.