Heterogeneous III–V silicon photonic integration: components and characterization
Heterogeneous III–V silicon (Si) photonic integration is considered one of the key methods for realizing power- and cost-effective optical interconnections, which are highly desired for future high-performance computers and datacenters. We review the recent progress in heterogeneous III–V/Si photoni...
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Veröffentlicht in: | Frontiers of information technology & electronic engineering 2019-04, Vol.20 (4), p.472-480 |
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Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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Zusammenfassung: | Heterogeneous III–V silicon (Si) photonic integration is considered one of the key methods for realizing power- and cost-effective optical interconnections, which are highly desired for future high-performance computers and datacenters. We review the recent progress in heterogeneous III–V/Si photonic integration, including transceiving devices and components. We also describe the progress in the on-wafer characterization of photonic integration circuits, especially on the heterogeneous III–V/Si platform. |
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ISSN: | 2095-9184 2095-9230 |
DOI: | 10.1631/FITEE.1800482 |