High Alumina Fiber Composite SiO2 Based Nanoporous Insulation Boards

The specimens were prepared with high alumina fiber accounting for 0. 5% , 10% or 15% by mass of the total amount of amorphous silica and high alumina fiber, using phenolic resin as binder, and extra-adding 0 or 0. 5% ZnO as sunscreen to cut the cost of SiO2 nanoporous insulation board. The hot volume stability and thermal conductivity （flat plate method ） of the specimens were tested and multi-Jimetion simulation equipment was used to study the thermal insulation performante. The results show that： （1） with high alumina fiber addition increasing, the linear shrinkage rate decreases, but thermal eonductivity changes a little; （2） adding ZnO can decrease thermal conductivity obviously; （3）for the specimen with ZnO and 15% of high alumina fiber, its cold face temperature hardly rises during the simulation experiment at 1 000 ℃ for 2 h, and the cold face temperature of the specimen with the smallest thickness of 2 cm doesn＇t exceed 180 ℃.