D301 resin as a solid base for phosphine-free Heck reactions with heteroaryl halides
A new and practical method of the D301 resin, a weak basic anion exchange resin with secondary amine functionality (Grade Matrix Structure: Styrene-DVB D301R), used as base to Heck reactions catalyzed by palladium reagent without phosphine compound as ligand is described. It was found that the D301...
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Veröffentlicht in: | Chinese chemical letters 2008-04, Vol.19 (4), p.399-402 |
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creator | Pei, Wen Wu, Xiang Mei |
description | A new and practical method of the D301 resin, a weak basic anion exchange resin with secondary amine functionality (Grade Matrix Structure: Styrene-DVB D301R), used as base to Heck reactions catalyzed by palladium reagent without phosphine compound as ligand is described. It was found that the D301 resin used as base is an efficient and reusable base and can be regenerated and recycled in the reaction. The olefination of heteroaryl halides prepared the corresponding products in good yields using D301 resin as base. |
doi_str_mv | 10.1016/j.cclet.2008.01.034 |
format | Article |
fullrecord | <record><control><sourceid>wanfang_jour_cross</sourceid><recordid>TN_cdi_wanfang_journals_zghxkb200804006</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><wanfj_id>zghxkb200804006</wanfj_id><els_id>S1001841708000454</els_id><sourcerecordid>zghxkb200804006</sourcerecordid><originalsourceid>FETCH-LOGICAL-c335t-de330b8a053f94950c17137ba78c9a3229a2afce4e3fa3e99903b372689b5b6b3</originalsourceid><addsrcrecordid>eNp9kLtOwzAUhiMEEqXwBCzemBKO41zsgQGVS5EqsZTZsp3jxmlIKjtcnx6XMjOdM_zfuXxJckkho0Cr6y4zpscpywF4BjQDVhwlM8prnpaiKo5jD0BTXtD6NDkLoQPIOWfVLFnfMaDEY3ADUYEoEsbeNUSrgMSOnuzaMexaN2BqPSJZotnGtDKTG4dAPtzUkhYn9KPyXz1pVYQxnCcnVvUBL_7qPHl5uF8vlunq-fFpcbtKDWPllDbIGGiuoGRWFKIEQ2vKaq1qboRieS5UrqzBAplVDIUQwDSr84oLXepKs3lydZj7oQarho3sxjc_xI3ye9N-bvVeBxQAVUyyQ9L4MQSPVu68e403Swpyr1B28leh3DMSqIwKI3VzoDA-8e7Qy2AcDgYb59FMshndv_wPGsZ6Ng</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>D301 resin as a solid base for phosphine-free Heck reactions with heteroaryl halides</title><source>Elsevier ScienceDirect Journals</source><source>Alma/SFX Local Collection</source><creator>Pei, Wen ; Wu, Xiang Mei</creator><creatorcontrib>Pei, Wen ; Wu, Xiang Mei</creatorcontrib><description>A new and practical method of the D301 resin, a weak basic anion exchange resin with secondary amine functionality (Grade Matrix Structure: Styrene-DVB D301R), used as base to Heck reactions catalyzed by palladium reagent without phosphine compound as ligand is described. It was found that the D301 resin used as base is an efficient and reusable base and can be regenerated and recycled in the reaction. The olefination of heteroaryl halides prepared the corresponding products in good yields using D301 resin as base.</description><identifier>ISSN: 1001-8417</identifier><identifier>EISSN: 1878-5964</identifier><identifier>DOI: 10.1016/j.cclet.2008.01.034</identifier><language>eng</language><publisher>Elsevier B.V</publisher><subject>D301 resin ; Heck reaction ; Palladium ; Phosphine-free catalysts</subject><ispartof>Chinese chemical letters, 2008-04, Vol.19 (4), p.399-402</ispartof><rights>2008 Wen Pei</rights><rights>Copyright © Wanfang Data Co. Ltd. All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c335t-de330b8a053f94950c17137ba78c9a3229a2afce4e3fa3e99903b372689b5b6b3</citedby><cites>FETCH-LOGICAL-c335t-de330b8a053f94950c17137ba78c9a3229a2afce4e3fa3e99903b372689b5b6b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttp://www.wanfangdata.com.cn/images/PeriodicalImages/zghxkb/zghxkb.jpg</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S1001841708000454$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3537,27901,27902,65306</link.rule.ids></links><search><creatorcontrib>Pei, Wen</creatorcontrib><creatorcontrib>Wu, Xiang Mei</creatorcontrib><title>D301 resin as a solid base for phosphine-free Heck reactions with heteroaryl halides</title><title>Chinese chemical letters</title><description>A new and practical method of the D301 resin, a weak basic anion exchange resin with secondary amine functionality (Grade Matrix Structure: Styrene-DVB D301R), used as base to Heck reactions catalyzed by palladium reagent without phosphine compound as ligand is described. It was found that the D301 resin used as base is an efficient and reusable base and can be regenerated and recycled in the reaction. The olefination of heteroaryl halides prepared the corresponding products in good yields using D301 resin as base.</description><subject>D301 resin</subject><subject>Heck reaction</subject><subject>Palladium</subject><subject>Phosphine-free catalysts</subject><issn>1001-8417</issn><issn>1878-5964</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNp9kLtOwzAUhiMEEqXwBCzemBKO41zsgQGVS5EqsZTZsp3jxmlIKjtcnx6XMjOdM_zfuXxJckkho0Cr6y4zpscpywF4BjQDVhwlM8prnpaiKo5jD0BTXtD6NDkLoQPIOWfVLFnfMaDEY3ADUYEoEsbeNUSrgMSOnuzaMexaN2BqPSJZotnGtDKTG4dAPtzUkhYn9KPyXz1pVYQxnCcnVvUBL_7qPHl5uF8vlunq-fFpcbtKDWPllDbIGGiuoGRWFKIEQ2vKaq1qboRieS5UrqzBAplVDIUQwDSr84oLXepKs3lydZj7oQarho3sxjc_xI3ye9N-bvVeBxQAVUyyQ9L4MQSPVu68e403Swpyr1B28leh3DMSqIwKI3VzoDA-8e7Qy2AcDgYb59FMshndv_wPGsZ6Ng</recordid><startdate>20080401</startdate><enddate>20080401</enddate><creator>Pei, Wen</creator><creator>Wu, Xiang Mei</creator><general>Elsevier B.V</general><general>College of Chemical Engineering and Materials,Zhejiang University of Technology,Hangzhou 310014,China%College of Chemical Engineering and Materials,Zhejiang University of Technology,Hangzhou 310014,China</general><general>College of Chemistry and Life Science,Lishui University,Lishui 323000,China</general><scope>AAYXX</scope><scope>CITATION</scope><scope>2B.</scope><scope>4A8</scope><scope>92I</scope><scope>93N</scope><scope>PSX</scope><scope>TCJ</scope></search><sort><creationdate>20080401</creationdate><title>D301 resin as a solid base for phosphine-free Heck reactions with heteroaryl halides</title><author>Pei, Wen ; Wu, Xiang Mei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c335t-de330b8a053f94950c17137ba78c9a3229a2afce4e3fa3e99903b372689b5b6b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>D301 resin</topic><topic>Heck reaction</topic><topic>Palladium</topic><topic>Phosphine-free catalysts</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Pei, Wen</creatorcontrib><creatorcontrib>Wu, Xiang Mei</creatorcontrib><collection>CrossRef</collection><collection>Wanfang Data Journals - Hong Kong</collection><collection>WANFANG Data Centre</collection><collection>Wanfang Data Journals</collection><collection>万方数据期刊 - 香港版</collection><collection>China Online Journals (COJ)</collection><collection>China Online Journals (COJ)</collection><jtitle>Chinese chemical letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Pei, Wen</au><au>Wu, Xiang Mei</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>D301 resin as a solid base for phosphine-free Heck reactions with heteroaryl halides</atitle><jtitle>Chinese chemical letters</jtitle><date>2008-04-01</date><risdate>2008</risdate><volume>19</volume><issue>4</issue><spage>399</spage><epage>402</epage><pages>399-402</pages><issn>1001-8417</issn><eissn>1878-5964</eissn><abstract>A new and practical method of the D301 resin, a weak basic anion exchange resin with secondary amine functionality (Grade Matrix Structure: Styrene-DVB D301R), used as base to Heck reactions catalyzed by palladium reagent without phosphine compound as ligand is described. It was found that the D301 resin used as base is an efficient and reusable base and can be regenerated and recycled in the reaction. The olefination of heteroaryl halides prepared the corresponding products in good yields using D301 resin as base.</abstract><pub>Elsevier B.V</pub><doi>10.1016/j.cclet.2008.01.034</doi><tpages>4</tpages></addata></record> |
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subjects | D301 resin Heck reaction Palladium Phosphine-free catalysts |
title | D301 resin as a solid base for phosphine-free Heck reactions with heteroaryl halides |
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