Evolution of AuSnx intermetallic compounds in laser reflowed micro-solder joints

To investigate the effect of Au thickness on evolution of AuSnx IMCs, pads with 0. 1, 0. 5 and 4. 0 μm thickness of Au surface finish were utilized. Laser reflowed solder joints were aged in 125℃ isothermal ovens. Results indicated that little IMC formed at the interface of solder and pad with 0. 1 μm thickness of Au. Even in condition of 744 hours aging, thickness of lMCs did not increase obviously. As for the joints with 0. 5 μm thickness of Au, most of AuSn4 IMCs stayed at the inteornce and were in needle-like or dendritic morphology. With the increase of aging time, AuSn4 IMCs beeame flat and changed to a continuous layer. In the joints with 4. 0 μm thickness of Au on pads, AuSn, AuSn2, AuSn4 IMCs and Au2Sn phase formed at the interface. As aging time was increased, more Sn rich IMCs formed at the interface, and evolved to AuSn4 IMCs in condition of long time aging. Thickness of AuSn4 IMCs reached about 30μm.