Study of diffusion bonding of Ti-6Al-4V and ZQSn10-10 with metal interlayer

The diffusion bonding was carried out to join Ti alloy (Ti-6Al-4V) and tin-bronze ( ZQSn10-10 ) with Ni and Ni + Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope (SEM), energy dispersive spectroscopy ( EDS ) and X-ray diffraction ( XRD )...

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Veröffentlicht in:China welding 2008-03, Vol.17 (1), p.36-39
1. Verfasser: 赵涣凌 赵贺 冯吉才 宋敏霞 赵熹华
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Sprache:eng
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Zusammenfassung:The diffusion bonding was carried out to join Ti alloy (Ti-6Al-4V) and tin-bronze ( ZQSn10-10 ) with Ni and Ni + Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope (SEM), energy dispersive spectroscopy ( EDS ) and X-ray diffraction ( XRD ). The results show that when the interlayer is Ni or Ni + Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds (Cu3Ti, CuTi etc. ). But the Ni-Ti intermetallic compounds (NiTi, Ni3Ti) are formed on the Ti-6Al-4V/Ni interface. When the interlayer is Ni, the optimum bonding parameters are 830 ℃/10 MPa/30 min. And when the interlayer is Ni + Cu, the optimum bonding parameters are 850 ℃/10 MPa/20 min. With the optimum bonding parameters, the tensile strength of the joints with Ni and Ni + Cu interlayer both are 155.8 MPa, which is 65 percent of the strength of ZQSn10-10 base metal.
ISSN:1004-5341