Electrochemical behavior of Cu-Zn-Al shape memory alloy after surface modification by electroless plated Ni-P

The electrochemical behavior of Cu-Zn-Al shape memory alloy (SMA) with and without electroless plated Ni-P was investigated by electrochemical methods in artificial Tyrode's solution. The results showed that Cu-Zn-Al SMA engendered dezincification corrosion in Tyrode's solution. The anodic active current densities as well as electrochemical dissolution sensitivity of the electroless plated Ni-P Cu-Zn-Al SMA increased with NaCl concentration rising, pH of solution decreasing and environmental temperature uprising. X-ray diffraction analysis indicated that after surface modification by electroless plated Ni-P, an amorphous plated film formed on the surface of Cu-Zn-Al SMA. This film can effectively isolate matrix metal from corrosion media and significantly improve the electrochemical property of Cu-Zn-Al SMA in artificial Tyrode's solution. (Copper alloys considered as candidate biomedical material to replace TiNi shape memory alloys.)