Solid-Liquid State Bonding of Si3N4 Ceramics with Ceramic-Modified Brazing Alloy

Solid-liquid state bonding of Si3N4 ceramics with TiN-modified Ag-Cu-Ti brazing alloy was used to enhance joint strength. The effects of the TiN particles on the microstructures, interfacial reactions, and room-temperature properties of the joints were investigated. The results show that the TiN particles are generally well dispersed in the Ag-Cu eutectic base and the interface between them is both clean and com-pact. Changes in the TiN volume fractions from 0 to 20% exert no noticeable effect on the interfacial reac-tion between Ag-Cu-Ti and the substrates. Other bonding parameters being constant, the TiN volume frac-tion in the filler material plays a key role in the joint properties. For TiN volume fractions below 20%, the joints are reinforced, especially joints with 5% and 20% TiN. The average shearing strength of joints with 5% TiN is 200.8 MPa, 30% higher than that of joints with no TiN (154.1 MPa). However, for TiN volumes frac-tions above 20%, the joint strengths decrease.