ANALYSIS OF NANOBRIDGE TESTS

ANALYSIS OF NANOBRIDGE TESTS

This paper analyzes nanobridge tests with consideration of adhesive contact deformation, which occurs between a probe tip and a tested nanobeam, and deformation of a substrate or template that supports the tested nanobeam.Analytical displacement-load relation, including adhesive contact deformation...

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Veröffentlicht in:Acta mechanica solida Sinica 2010-08, Vol.23 (4), p.283-296
Hauptverfasser: Chan, Wing Kin, Li, Jianrong, Wang, Yong, Zhang, Shengyao, Zhang, Tongyi
Format: Artikel
Sprache:eng
Schlagworte:
adhesion
Adhesives
Classical Mechanics
Contact
contact compliance
Deformation
Engineering
finite element
Mathematical analysis
nanobridge tests
Nanocomposites
Nanomaterials
Nanostructure
size-dependency
substrate effect
surface effect
Surfaces and Interfaces
Theoretical and Applied Mechanics
Thin Films
Ultrasonic testing
弯曲变形
接触变形
有限元分析
杨氏模量
测试数据分析
粘合剂
胶粘剂
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Beschreibung
Zusammenfassung:This paper analyzes nanobridge tests with consideration of adhesive contact deformation, which occurs between a probe tip and a tested nanobeam, and deformation of a substrate or template that supports the tested nanobeam.Analytical displacement-load relation, including adhesive contact deformation and substrate deformation, is presented here for small deformation of bending.The analytic results are confirmed by finite element analysis.If adhesive contact deformation and substrate deformation are not considered in the analysis of nanobridge test data, they might lead to lower values of Young＇s modulus of tested nanobeams.
ISSN:0894-9166
1860-2134
DOI:10.1016/S0894-9166(10)60031-6