Growth of Casting Microcrack and Micropore in Single-crystal Superalloys Analysed by Three-Dimensional Unit Cell

Finite element (FE) analysis was employed to investigate the casting microcrack and micropore growth in nickel-base single-crystal superalloys DD3. Based on the finite deformation rate-dependent crystallographic constitutive equation, the simulations of casting microcrack and micropore growth in three-dimensional unit cell model were carried out in a range of parameters including stress triaxiality, Lode parameter and type of activated slip systems. The FE results show that the stress triaxiality has profound effects on growth behavior, and the Lode parameter is also important for the casting microcrack and micropore growth. The type of operative slip systems has remarkable effect on casting microcrack and micropore growth, so the life of singlecrystal component is associated with the type of activated slip systems, which is related to Schmid factor and the number of activated slip systems. The growth comparison between microcrack and micropore reveals that when the material is subjected to large deformation, the growth rate of microcrack is faster than that of micropore, i.e. microcrack is more dangerous than micropore; the microcrack is easier to result in brittle fracture than micropore. The stress triaxiality and Lode parameter have strong influence on the growth of microcrack and micropore.