High-precision weighing module with reduced thermal gradient

An integrated high-precision weighing module has a shell, an electromagnetic force sensor, a printed circuit board (PCB), a weighing pan component, a support ring, and an air baffle ring. The electromagnetic force sensor and the PCB are mounted in the shell. A bearing head of the electromagnetic force sensor extends upward from an upper end portion of the shell. The support ring sheathes the bearing head. The weighing pan component is mounted on the bearing head, with the support ring located between the weighing pan component and the shell. The air baffle ring is disposed around the weighing pan component and located on the support ring. A first airflow channel is formed among the shell, the support ring, and the air baffle ring. At least part of airflow in the shell flows to the outside through the first airflow channel.