Integrated circuit inductor with integrated vias
Integrated circuit inductors are formed by interconnecting various metal layers in an integrated circuit with continuous vias. Using continuous vias improves the Q factor over existing methods for high frequency applications. The contiguous length of the continuous vias should be greater than three...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Integrated circuit inductors are formed by interconnecting various metal layers in an integrated circuit with continuous vias. Using continuous vias improves the Q factor over existing methods for high frequency applications. The contiguous length of the continuous vias should be greater than three percent of the length of the inductor. |
---|