Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method

Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method

The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Chida, Takafumi, Nakano, Takahiro, Izuhara, Koichi, Tsujimoto, Yoshiyuki
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Chida, Takafumi
Nakano, Takahiro
Izuhara, Koichi
Tsujimoto, Yoshiyuki
description The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement part having the multiple placement heads simultaneously pick up the components from the pallet and simultaneously place the components on the circuit board, the controller specifies a pair of component groups to be picked up simultaneously from the pallet by the multiple placement heads and places the components on the circuit board, so that an area where the multiple placement heads move in overlapping manner is minimized, and the placement heads respectively pick up the components included in the pair of component groups being specified and place the components on the circuit board.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_08340803</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>08340803</sourcerecordid><originalsourceid>FETCH-uspatents_grants_083408033</originalsourceid><addsrcrecordid>eNrjZOh1zs8tyM9LzStRKMhJTE7NBbESCwoSixJLSot1FJKxSBenlpRk5qUrJCfmJJfmJJZk5uchaykoyk8vSszVUUjMSyFaf25qSUZ-Cg8Da1piTnEqL5TmZlBwcw1x9tAtLS5ILAHqLY4HGg2iDCyMTQwsDIyNiVACAATQUIY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method</title><source>USPTO Issued Patents</source><creator>Chida, Takafumi ; Nakano, Takahiro ; Izuhara, Koichi ; Tsujimoto, Yoshiyuki</creator><creatorcontrib>Chida, Takafumi ; Nakano, Takahiro ; Izuhara, Koichi ; Tsujimoto, Yoshiyuki ; Hitachi High-Tech Instruments Co., Ltd</creatorcontrib><description>The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement part having the multiple placement heads simultaneously pick up the components from the pallet and simultaneously place the components on the circuit board, the controller specifies a pair of component groups to be picked up simultaneously from the pallet by the multiple placement heads and places the components on the circuit board, so that an area where the multiple placement heads move in overlapping manner is minimized, and the placement heads respectively pick up the components included in the pair of component groups being specified and place the components on the circuit board.</description><language>eng</language><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8340803$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8340803$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Chida, Takafumi</creatorcontrib><creatorcontrib>Nakano, Takahiro</creatorcontrib><creatorcontrib>Izuhara, Koichi</creatorcontrib><creatorcontrib>Tsujimoto, Yoshiyuki</creatorcontrib><creatorcontrib>Hitachi High-Tech Instruments Co., Ltd</creatorcontrib><title>Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method</title><description>The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement part having the multiple placement heads simultaneously pick up the components from the pallet and simultaneously place the components on the circuit board, the controller specifies a pair of component groups to be picked up simultaneously from the pallet by the multiple placement heads and places the components on the circuit board, so that an area where the multiple placement heads move in overlapping manner is minimized, and the placement heads respectively pick up the components included in the pair of component groups being specified and place the components on the circuit board.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZOh1zs8tyM9LzStRKMhJTE7NBbESCwoSixJLSot1FJKxSBenlpRk5qUrJCfmJJfmJJZk5uchaykoyk8vSszVUUjMSyFaf25qSUZ-Cg8Da1piTnEqL5TmZlBwcw1x9tAtLS5ILAHqLY4HGg2iDCyMTQwsDIyNiVACAATQUIY</recordid><startdate>20121225</startdate><enddate>20121225</enddate><creator>Chida, Takafumi</creator><creator>Nakano, Takahiro</creator><creator>Izuhara, Koichi</creator><creator>Tsujimoto, Yoshiyuki</creator><scope>EFH</scope></search><sort><creationdate>20121225</creationdate><title>Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method</title><author>Chida, Takafumi ; Nakano, Takahiro ; Izuhara, Koichi ; Tsujimoto, Yoshiyuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_083408033</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Chida, Takafumi</creatorcontrib><creatorcontrib>Nakano, Takahiro</creatorcontrib><creatorcontrib>Izuhara, Koichi</creatorcontrib><creatorcontrib>Tsujimoto, Yoshiyuki</creatorcontrib><creatorcontrib>Hitachi High-Tech Instruments Co., Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chida, Takafumi</au><au>Nakano, Takahiro</au><au>Izuhara, Koichi</au><au>Tsujimoto, Yoshiyuki</au><aucorp>Hitachi High-Tech Instruments Co., Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method</title><date>2012-12-25</date><risdate>2012</risdate><abstract>The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement part having the multiple placement heads simultaneously pick up the components from the pallet and simultaneously place the components on the circuit board, the controller specifies a pair of component groups to be picked up simultaneously from the pallet by the multiple placement heads and places the components on the circuit board, so that an area where the multiple placement heads move in overlapping manner is minimized, and the placement heads respectively pick up the components included in the pair of component groups being specified and place the components on the circuit board.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_08340803
source USPTO Issued Patents
title Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T23%3A30%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Chida,%20Takafumi&rft.aucorp=Hitachi%20High-Tech%20Instruments%20Co.,%20Ltd&rft.date=2012-12-25&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E08340803%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true