Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method

The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement part having the multiple placement heads simultaneously pick up the components from the pallet and simultaneously place the components on the circuit board, the controller specifies a pair of component groups to be picked up simultaneously from the pallet by the multiple placement heads and places the components on the circuit board, so that an area where the multiple placement heads move in overlapping manner is minimized, and the placement heads respectively pick up the components included in the pair of component groups being specified and place the components on the circuit board.