Parallel testing of an integrated circuit that includes multiple dies

A method of testing an integrated circuit (IC) having a plurality of dies can include receiving, within a master die of the plurality of dies of the IC, a configuration data set specifying a circuit design, wherein the circuit design is instantiated within the master die. The method can include broadcasting the configuration data set to at least one slave die, wherein the circuit design is instantiated within each slave die and receiving, within the master die, a test vector set. The method also can include broadcasting the test vector set to the at least one slave die and responsive to each die executing the test vector set, storing test output data generated by each die.