Out of plane integral conductive arms and methods for manufacturing the same

A printed circuit board includes a multiple-layer electrical circuit board and a conductive arm, wherein the conductive arm has an unconnected end located opposite to the connected end of the conductive arm, wherein the conductive arm has a front side and a backside located opposite to the front side of the conductive arm, wherein the backside of the conductive arm is located adjacent to the multiple layer electrical circuit board. The unconnected end of the conductive arm includes a dimple portion formed integrally with and as a unitary part of a remaining portion of the conductive arm, the dimple portion being out of plane with in plane portions of the connected end of the conductive arm so that the dimple portion is at a greater distance from the circuit board than the in plane portions of the conductive arm, the dimple portion being connected to the in plane portions of the conductive arm via an integrally formed and unitary riser portion. An air gap is formed between the backside of the arm and the multiple layer electrical circuit board, wherein the air gap permits the arm to flex within the air gap. An ink jet component is laminated to the printed circuit board, wherein the dimple on the front side of the arm contacts a surface of the component, wherein a restoring spring force of the conductive arm maintains electrical contactivity between the dimple and the component.