Sacrificial CMP etch stop layer

A chemical mechanical polishing (CMP) stop layer is implemented in a semiconductor fabrication process. The CMP stop layer, among other things, mitigates erosion of sidewall spacers during semiconductor fabrication and adverse effects associated therewith.

Bibliographische Detailangaben

Hauptverfasser:	Pas, Michael Francis, Ramin, Manfred
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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