Sacrificial CMP etch stop layer
A chemical mechanical polishing (CMP) stop layer is implemented in a semiconductor fabrication process. The CMP stop layer, among other things, mitigates erosion of sidewall spacers during semiconductor fabrication and adverse effects associated therewith.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A chemical mechanical polishing (CMP) stop layer is implemented in a semiconductor fabrication process. The CMP stop layer, among other things, mitigates erosion of sidewall spacers during semiconductor fabrication and adverse effects associated therewith. |
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