Electronic assemblies without solder having overlapping components
An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components are stacked so that they overlap each other and are encapsulated in an electronic insulating material . The resulting subassembly may be integrated onto a printed circuit board or in...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components are stacked so that they overlap each other and are encapsulated in an electronic insulating material . The resulting subassembly may be integrated onto a printed circuit board or into a reverse-interconnection process assembly. |
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