Mounting method using dilatancy fluid

Even pressure is applied to a mounting target, even in a case where electronic components having different heights from each other are attempted to be mounted to a substrate, or in a case where an electronic component is attempted to be mounted to a substrate whose rear surface is provided with another electronic component. A mounting device includes a lower pressurizing section as a first pressurizing section and an upper pressurizing section as a second pressurizing section, and pressurizes a substrate, a plurality of electronic components, and the like, sandwiched between the lower pressurizing section and the upper pressurizing section thereby mounting the substrate to the plurality of electronic components. The lower pressurizing section or the upper pressurizing section includes a dilatancy fluid