Integrated circuit package system with filled wafer recess

Integrated circuit package system with filled wafer recess

An integrated circuit package system is provided including forming a wafer having a back side and an active side, forming a recess in the wafer from the back side, forming a cover in the recess, and singulating the wafer at the recess filled with the cover.

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Bibliographische Detailangaben
Hauptverfasser: Guillermo, Dennis, Magno, Sheila Rima C, Asoy, Ma. Shirley, Marimuthu, Pandi Chelvam
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An integrated circuit package system is provided including forming a wafer having a back side and an active side, forming a recess in the wafer from the back side, forming a cover in the recess, and singulating the wafer at the recess filled with the cover.