Flip chip mounting method and bump forming method

aaaaThe invention involves mounting a solder resin composition including a solder powder and a resin on the first electronic component; arranging such that the connecting terminals of the first electronic component and the electrode terminals of the second electronic component are facing each other; ejecting a gas from a gas generation source included in the first electronic component by heating the first electronic component and the solder resin composition; and inducing the flow of the solder powder in the solder resin composition by inducing convection of the gas in the solder resin composition, and electrically connecting the connecting terminals and the electrode terminals by self-assembly on the connecting terminals and the electrode terminals. Through this are provided a flip chip packaging method that enables connecting, with high connection reliability, electrode terminals of a semiconductor chip wired with narrow pitch and connecting terminals of a circuit board, and a bump formation method for packaging on a circuit board.