Device for reducing thermal stress on connection points

The present invention relates to a device adapted in order to decrease stress on connection points between a heat generating source and a substrate. The device comprises a larger heat-dissipating part , and at least one smaller heat-dissipating part . The larger part is arranged with at least one cavity for housing the at least one smaller part . The at least one smaller part is adapted to be attached to at least one heat-generating source , and at the same time more mobile in the cavity and/or less affected by changes in temperature than the larger part.