Reliability enhancement of metal thermal interface

A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to me...

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Bibliographische Detailangaben
Hauptverfasser:	Humenik, James N, Iruvanti, Sushumna, Langlois, Richard, Liu, Hsichang, Natarajan, Govindarajan, Sikka, Kamal K, Toy, Hilton T, Zheng, Jiantao, Monjeau, Gregg B, Kapfhammer, Mark
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.