Method and apparatus for processing a microsample

An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an app...

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Bibliographische Detailangaben
Hauptverfasser: Tokuda, Mitsuo, Fukuda, Muneyuki, Mitsui, Yasuhiro, Koike, Hidemi, Tomimatsu, Satoshi, Shichi, Hiroyasu, Kashima, Hideo, Umemura, Kaoru
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.