Vacuum insulation panel with a lead-through

To provide a cost-effective, stable vacuum insulation panel having at least one lead-through in a main surface of an insulating material supporting body and having a vacuum-tight film envelope, it is proposed that the lead-through is formed as a bush with an outer side facing the insulating material supporting body and that on the first bush end is provided a first, preformed collar extending radially away from the bush into the main surface and, opposite said collar, is provided a second collar formed by thermal deformation of the second bush end, wherein the vacuum-tight film envelope is welded to the collars. A corresponding method for producing the panel is also described.