Cluster tool architecture for processing a substrate

An apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, a smaller system footprint, and a more repeatable wafer history. Embodiments provide for a cluster tool comprising first and se...

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Bibliographische Detailangaben
Hauptverfasser:	Ishikawa, Tetsuya, Roberts, Rick J, Armer, Helen R, Volfovski, Leon, Pinson, Jay D, Rice, Michael, Quach, David H, Salek, Mohsen S, Lowrance, Robert, Backer, John A, Weaver, William Tyler, Carlson, Charles, Wang, Chongyang, Hudgens, Jeffrey, Herchen, Harald, Lu, Brian
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	An apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, a smaller system footprint, and a more repeatable wafer history. Embodiments provide for a cluster tool comprising first and second processing racks, each having two or more vertically stacked substrate processing chambers, a first robot assembly able to access the first processing rack from a first side, a second robot assembly able to access the first processing rack from a second side and the second processing rack from a first side, a third robot assembly able to access the second processing rack from a second side, and a fourth robot assembly able to access the first and second processing racks and to load substrates in a cassette.