Methods for reducing UV and dielectric diffusion barrier interaction

Methods for reducing UV and dielectric diffusion barrier interaction

Stability of an underlying dielectric diffusion barrier during deposition and ultraviolet (UV) processing of an overlying dielectric layer is critical for successful integration. UV-resistant diffusion barrier layers are formed by depositing the layer in a hydrogen-starved environment. Diffusion bar...

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Hauptverfasser: Chattopadhyay, Kaushik, Fox, Keith, Mountsier, Tom, Wu, Hui-Jung, van Schravendijk, Bart, Branshaw, Kimberly
Format: Patent
Sprache:eng
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Zusammenfassung:Stability of an underlying dielectric diffusion barrier during deposition and ultraviolet (UV) processing of an overlying dielectric layer is critical for successful integration. UV-resistant diffusion barrier layers are formed by depositing the layer in a hydrogen-starved environment. Diffusion barrier layers can be made more resistant to UV radiation by thermal, plasma, or UV treatment during or after deposition. Lowering the modulus of the diffusion barrier layer can also improve the resistance to UV radiation.