Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus
bbA flip-chip mounting apparatus has a shield film on the side of a pressurizing film of a tool protection sheet. When a semiconductor chip is heated and pressurized via the tool protection sheet, the pressurizing film is released from a mold by a sheet fixing jig, and is expanded by a pressurizing/...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | bbA flip-chip mounting apparatus has a shield film on the side of a pressurizing film of a tool protection sheet. When a semiconductor chip is heated and pressurized via the tool protection sheet, the pressurizing film is released from a mold by a sheet fixing jig, and is expanded by a pressurizing/heating tool to abut against an insulating resin film protruding from the periphery of the semiconductor chip and cure the insulating resin film with an external pressure being applied. |
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