Heat stable aryl polysiloxane compositions

A curable aryl siloxane composition is disclosed. A heat stable cured aryl polysiloxane composition is further disclosed, along with a method of making that heat stable cured aryl polysiloxane composition from the curable aryl siloxane composition. An encapsulated semiconductor device, and a method...

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Bibliographische Detailangaben
Hauptverfasser: Khanarian, Garo, Mosley, David Wayne
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A curable aryl siloxane composition is disclosed. A heat stable cured aryl polysiloxane composition is further disclosed, along with a method of making that heat stable cured aryl polysiloxane composition from the curable aryl siloxane composition. An encapsulated semiconductor device, and a method of making that encapsulated semiconductor device by coating a semiconductor element of a semiconductor device with the heat stable cured aryl polysiloxane are further disclosed.