Two-track surface acoustic wave structure without internal pads
The present disclosure relates to a two-track surface acoustic wave (SAW) device that has a reduced size compared to a traditional two-track SAW device by eliminating an internal ground connection node of the traditional two-track SAW device. The internal ground connection node is eliminated by coup...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The present disclosure relates to a two-track surface acoustic wave (SAW) device that has a reduced size compared to a traditional two-track SAW device by eliminating an internal ground connection node of the traditional two-track SAW device. The internal ground connection node is eliminated by coupling an internal ground interconnection to an external ground connection node through an interconnecting ground grating, which is part of one of two SAW tracks of the two-track SAW device. The internal ground interconnection is located in an internal region of the two-track SAW device that is defined by the two SAW tracks and by two electrical interconnections between the two SAW tracks. |
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