Embedded inductor and method of producing thereof
A method of manufacturing an inductor embedded into a semiconductor chip package is described, which method comprises providing a carrier having, between a first side and an opposite second side, a first conductive layer, an intermediate layer, a second conductive layer, forming an inductor and cont...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method of manufacturing an inductor embedded into a semiconductor chip package is described, which method comprises providing a carrier having, between a first side and an opposite second side, a first conductive layer, an intermediate layer, a second conductive layer, forming an inductor and contact pads for the chip by patterning the first conductive layer from the first side of the carrier, assembling the chip and providing an encapsulation and forming terminals of the package, by patterning the second conductive layer from the second side of the carrier. |
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