Wire bonding over active circuits
A semiconductor device includes a semiconductor die mounted over a package substrate. The die has a bond pad located thereover. A stud bump consisting substantially of a first metal is located on the bond pad. A wire consisting substantially of a different second metal is bonded to the stud bump.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor device includes a semiconductor die mounted over a package substrate. The die has a bond pad located thereover. A stud bump consisting substantially of a first metal is located on the bond pad. A wire consisting substantially of a different second metal is bonded to the stud bump. |
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