Removal of surface oxides by electron attachment for wafer bumping applications

Removal of surface oxides by electron attachment for wafer bumping applications

The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the targe...

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Hauptverfasser: Dong, Chun Christine, McDermott, Wayne Thomas, Schwarz, Alexander, Arslanian, Gregory Khosrov, Patrick, Richard E
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Sprache:eng
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creator Dong, Chun Christine
McDermott, Wayne Thomas
Schwarz, Alexander
Arslanian, Gregory Khosrov
Patrick, Richard E
description The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
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In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.</description><language>eng</language><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8119016$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64037</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8119016$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Dong, Chun Christine</creatorcontrib><creatorcontrib>McDermott, Wayne Thomas</creatorcontrib><creatorcontrib>Schwarz, Alexander</creatorcontrib><creatorcontrib>Arslanian, Gregory Khosrov</creatorcontrib><creatorcontrib>Patrick, Richard E</creatorcontrib><creatorcontrib>Air Products and Chemicals, Inc</creatorcontrib><title>Removal of surface oxides by electron attachment for wafer bumping applications</title><description>The present invention relates to a method for removing metal oxides from a substrate surface. 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title Removal of surface oxides by electron attachment for wafer bumping applications
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