Solder ball mounting method and apparatus
aaaaaThe periphery of a mask is formed higher than a region where a ball holding hole is formed, a work is arranged at a lower section of the ball holding hole of the mask, and the ball holding hole and an electrode of the work are aligned with each other. A ball (B) is applied on the mask, and in s...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | aaaaaThe periphery of a mask is formed higher than a region where a ball holding hole is formed, a work is arranged at a lower section of the ball holding hole of the mask, and the ball holding hole and an electrode of the work are aligned with each other. A ball (B) is applied on the mask, and in such state, vibration is applied to the mask to move the solder ball (B) on the surface of the mask and drop the solder ball (B) into the ball holding hole. The periphery of the mask is permitted to be lower than the ball holding hole, and an excessive portion of the solder ball (B) is recovered from over the mask. |
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