Electronic component mounting apparatus
aa a An electronic component mounting apparatus includes a substrate conveyance mechanism for conveying substrates and ; a first drawing head for supplying the substrate with paste at a mounting position; a second drawing head for supplying the paste to the substrate at a pre-paste supply position c...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | aa a An electronic component mounting apparatus includes a substrate conveyance mechanism for conveying substrates and ; a first drawing head for supplying the substrate with paste at a mounting position; a second drawing head for supplying the paste to the substrate at a pre-paste supply position closer to a conveyance starting side rather than to the mounting position; and a bonding head that mounts, at the mounting position, electronic components on the substrate supplied with the paste at the pre-paste supply position. |
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