Method for fabricating plated product

a a b A bumper molding is fabricated by disposing segmented anodes and on surfaces and of a base material , which are to be plated, and performing electroplating so as to form metal films on the surfaces and , respectively. The curvature of a surface of a concave portion, which is formed in each par...

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Hauptverfasser: Matsuoka, Ryoji, Furutani, Muneo, Nasu, Masato, Inoue, Takeshi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:a a b A bumper molding is fabricated by disposing segmented anodes and on surfaces and of a base material , which are to be plated, and performing electroplating so as to form metal films on the surfaces and , respectively. The curvature of a surface of a concave portion, which is formed in each part of the surfaces and so that the surface of the concave portion is away from the segmented anodes and , respectively, is larger than those of other portions at a part serving as a border between the second plated surface and the fourth plated surface . Accordingly, the distance from the part serving as the border between the second plated surface and the fourth plated surface to a metal case corresponding to this part is set so as to be shorter than those from each of the other parts to the metal cases and respectively corresponding to the segmented anodes and