Method of enhancing on-chip inductance structure utilizing silicon through via technology

A method is provided that utilizes silicon through via technology, to build a Toroid into the chip with the addition of a layer of magnetic material such as Nickel above and below the T-coil stacked multi-ring structure. This allows the connection between the inner via and an array of outer vias. Th...

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Bibliographische Detailangaben

Hauptverfasser:	Maki, Andrew Benson, Bartley, Gerald Keith, Germann, Philip Raymond, Maxson, Mark Owen, Becker, Darryl John, Dahlen, Paul Eric, Sheets, II, John Edward
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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